Zafeiropoulou, Konstantina and Kostagiannakopoulou, Christina and Georgopoulou, Marita and Vogiantzi, Christina and Loutas, Theodoros and Tsantzalis, Stavros and Sotiriadis, George and Kostopoulos, Vassilis (2021) Development of Multi-Functional Hybrid Carbon-Based Nano-Reinforced Epoxy Adhesives. World Journal of Mechanics, 11 (12). pp. 258-274. ISSN 2160-049X
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Abstract
In an effort to expand the insulating behavior of adhesives, incorporated nano-sized fillers, such as multi-walled carbon nanotubes (MWCNTs) and graphene nanoplatelets (GNPs), are usually selected. Including both MWCNTs and GNPs into polymers is assumed to have complementary influence (synergy), providing a new research area. Nevertheless, limited studies have been carried out towards this hybrid direction, as it is challenging to achieve a uniform distribution of both fillers into the polymer matrix. In this work, the addition of MWCNTs and GNPs into the epoxy adhesives has been studied to increase their thermal and electrical conductivity without diminishing their mechanical properties. Three types of nano-reinforced adhesives were developed by using: 1) 2%wt. MWCNTs, 2) 8%wt. GNPs and 3) 1%wt. MWCNTs and 8%wt. GNPs. The production of nano-reinforced adhesives was achieved by using a three-roll milling technique, while during the experimental characterization single lap shear tests, thermal and electrical conductivity measurements were performed. According to the results, the introduction of nano-particles caused significant increases in electrical and thermal conductivity. MWCNTs in content of 2%wt. showed the highest improvement in the electrical conductivity (9 orders of magnitude), while GNPs in content of 8%wt. recorded the highest increase (207%) in the thermal conductivity of nano-reinforced adhesives. Finally, it was observed that the hybrid system successfully contributed to the development of a multi-functional epoxy adhesive with improved thermal and electrical properties without significantly compromising its mechanical properties.
Item Type: | Article |
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Subjects: | Asian STM > Engineering |
Depositing User: | Managing Editor |
Date Deposited: | 11 Feb 2023 06:21 |
Last Modified: | 27 Feb 2024 04:24 |
URI: | http://journal.send2sub.com/id/eprint/579 |